Company

Qualcomm Technologies, Inc.

Job Area

Interns Group, Interns Group > Interim Engineering Intern - HW

General Summary

About Qualcomm

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We’re proud to be the partner of choice to many of the world’s largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. We're passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you'll be part of a community that's pushing the boundaries of what's possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you'll have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2026 summer intern class!

Role Overview

As a Qualcomm Hardware Engineering Intern, you’ll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of the following Qualcomm multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

This Internship Supports Multiple Technical Tracks, Including

GPU Engineering
CPU Engineering
Digital Design / DV
SoC Systems Engineering

Based on your resume you may be aligned to one or more of these tracks. Please clearly indicate your track interest(s) in your resume, as this is the only way to communicate preferences during the recruiting process.

Minimum Qualifications

Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog

Preferred Qualifications

Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Currently enrolled in a Master’s or PhD degree program in computer engineering, electrical engineering, or a related field

Track 1: GPU Engineering

Engineering design and development in MSM SOC and chipset architecture
ASIC implementation of image processing camera IP
GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
Graphics power analysis & optimization (Vulkan)
Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python

Track 2: CPU Engineering

Validation of CPU and SOC-level micro-architecture concepts
Development of test and coverage plans, verification methodology, and scalable environments
Execution of verification plans including regression, debug, and bring-up
Familiarity with simulators, coverage tools, waveform viewers
Programming experience in C, C++, Python

Track 3: Digital Design / DV

RTL development for modem physical and MAC layer processing
Verification component development using SystemVerilog and UVM
Modeling cellular modem datapaths for bit-exact correctness
Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab

Track 4: SoC Systems Engineering

Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
System-level performance modeling and simulation
Power and thermal management strategies
Post-silicon validation and characterization
Embedded software design, driver development for Linux/Windows
OS principles and HW/SW interaction
Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
Understanding of power/performance tradeoffs and system-level architecture
Programming experience in C/C++, Python; scripting and profiling tools

Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.

Application Process

By applying here, you are expressing interest in one of our many 2026 Qualcomm Hardware Engineering internships. It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries (see current country list below – subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay Range And Other Compensation & Benefits

$15.30 - $98.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

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Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2026